Ionized dopant concentrations at the heavily doped surface of a silicon solar cell
Read Online

Ionized dopant concentrations at the heavily doped surface of a silicon solar cell

  • 715 Want to read
  • ·
  • 62 Currently reading

Published by National Aeronautics and Space Administration, Scientific and Technical Information Service, for sale by the National Technical Information Service in [Washinbgton], Springfield, Va .
Written in English


  • Solar batteries,
  • Photovoltaic power generation

Book details:

Edition Notes

StatementIrving Weinberg ... [et al.], Lewis Research Center
SeriesNASA technical paper ; 1347
ContributionsWeinberg, Irving, 1918-, United States. National Aeronautics and Space Administration. Scientific and Technical Information Office
The Physical Object
Pagination16 p. :
Number of Pages16
ID Numbers
Open LibraryOL14932239M

Download Ionized dopant concentrations at the heavily doped surface of a silicon solar cell


The dopant profile show an exponential decay after closing the dopant cell if the segregation length is constant. Antimony doped Ge 1–y Sn y layers with y ≤ were grown at a substrate temperature of °C with nominal dopant concentrations up to 10 20 cm −3 (Augel et al., ; Srinivasan et al., ). However, both measurements of. A contactless and non-destructive method for the determination of the doping concentration of heavily doped silicon wafers is proposed. p-type dopant concentrations and species B, Ga, and In. As we know, the open circuit voltage equals to the quasi-Fermi level separation of a solar cell under illumination. Common way to calculate the voltage is using the equation, KT/q*ln(Iph/I0+1). Heavily doped surfaces-often called emitters, diffusions, or back-surface fields-are complicated regions of a solar cell. In these regions, the dopant concentration varies over many orders of.

Highly doped or emitter regions in silicon solar cells can be formed by thermal diffusion, laser doping or ion implantation. They are commonly characterized by a saturation current density parameter, J oe, that encompasses recombination within the bulk of the thin heavily doped region as well as the recombination at the emitter doped both sides of a wafer are diffused and the excess.   In the present study, the silicon epi-layers were doped to a wide range of doping concentrations, from /cm3 to 5 /cm3. In order to evaluate the quality of silicon LPE layers, p-n junction solar cells were fabricated upon p-type layers deposited on very heavily doped (5 mf~ cm) single crystalline silicon substrates.   Base current component for uniformly doped p-type silicon at K as a function of the dopant concentration. #m from the free surface and the space charge region depleted of free carriers is a little under #m wide, so that the effective width WE of the emitter region may be taken as #m. The carrier density and Fermi energy are shown in the figure below for silicon doped with 10 16 cm-3 donors and 10 15 cm-3 acceptors: - Fig Electron density and Fermi energy as a function of temperature in silicon with N d = 10 16 cm-3,N a = 10 14 cm-3 and E C - E D = E A - E V = 50 meV. The activation energy at.

We propose that a combination of factors is contributing to the observed fast etching rate of heavily doped n-type c-Si. of silicon MEMS and solar cell devices. surface dopant. Heavily antimony-doped silicon has lower concentration of oxygen impurities; minimal autodoping effects make it suitable for epitaxial substrates. [15] Bismuth is a promising dopant for long-wavelength infrared photoconduction silicon detectors, a viable n-type alternative to the p-type gallium-doped .   B- and P-doped Si-NCs formed as multilayers in a SiO 2 matrix have been fabricated, aiming at the development of silicon quantum dot based solar cells,,,,,,,,,,. B-doped Si-NCs were formed by magnetron co-sputtering of Si, SiO 2 and B 2 O 3 targets, while for P-doped Si-NCs, Si, SiO 2 and P 2 O 5 targets were used.   By combining the modified equations and the fitting results, the ionized dopant concentrations were estimated and are summarized in Fig. 5(a). The ionized dopant concentration gradually increased from × 10 17 cm −3 to × 10 18 cm −3 with increasing T Si and then decreased when T Si was larger than °C.